The article states this technology is intended to automatically repair integrated circuits via "microcapsules, as small as 10 microns in diameter". Being charitable and going with 90 nm geometries (which we still used in our company last year - we are a bit slow) that's too large by a factor of 100. Interesting for PCBs, but not for integrated circuits.
The article also states that the technology would fix things "so fast that the user never knew there was a problem" and then explains that "a failure interrupts current for mere microseconds".
The summary corrupts that somewhat into the claim that "operation can continue without interruption". It's far too slow for that. Let's assume a rather slow 33 MHz bus - that gives us a clock period of 30 ns - so we'd miss at least 33 clock cycles in this scenario. This interruption might not be noticed by the user, if an error correcting protocol is used on the bus and the system retransmits. Otherwise you would get wrong data, and you have to assume that will be noticed sooner or later.
Interesting technology on PCBs or communication wires, I could see it being used in safety-critical applications. On integrated circuits it doesn't seem feasible. Basically you make the transistors and wires on ICs already as small as you can. To repair the wires on the IC you now need to insert capsules into the wires to do the automatic repair - so they would be way smaller than the wires. If you could manufacture these structures you'd make the wires smaller though and then you'd lose your ability to insert the microcapsules
weta rudolph the red nosed reindeer rudolph the red nosed reindeer adam carolla desean jackson rick neuheisel rick neuheisel
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